The team of Professor Gao Chao of the Department of Polymer Science, Zhejiang University has recently developed a high thermal conductivity super-flexible graphene assembly film with a thermal conductivity close to 40% of the ideal single-layer graphene thermal conductivity. It can be folded 6,000 times and bent 100,000 times. It is expected to be applied in Electronic components, heat transfer, a new generation of flexible electronic devices and aerospace.
Among the existing macro materials, high thermal conductivity and high flexibility are contradictions, and it is often difficult to have both. The ductility of graphene micro-pleats makes it able to withstand complex deformations such as repeated folding, knotting, twisting, bending, origami, and is also more suitable for industrial scale production.
The highly flexible graphene film also has excellent thermal conductivity. According to the researchers, the core components of electronic components have their own stable operating temperature range. In general, the temperature is increased by 8 ° C to 10 ° C, and the life of electronic devices will be reduced by half. In the experiment, the researchers replaced this commercial graphene film with a commercial graphite film and applied it to the heat sink film of the mobile phone. It was found that the temperature at the CPU of the mobile phone can be controlled below 33 ° C, which is 6 ° C lower than that of the commercial graphite film.
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